This highly accessible book explains ESD in the manufacturing environment, in chip design, and present day systems. It will describe modern day problems in the semiconductor environment, and the future (beyond the next 5 years).?In addition, it will utilize examples of modern equipment, to modern technology. The first chapter offers an introduction to electrostatics and electromagnetism. Topics covered include: charge, tribo-charging, and charge Transfer, fields and potentials, Coulombs Law, Maxwells Equations, electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It also looks at todays scaling issues, nanostructures, MEMs, semiconductors, materials, and applications such as cell phones, notebooks, digital cameras and games. The second chapter covers the fundamentals of manufacturing and electrostatics. This chapter discusses materials, human discharge, and human induced electric fields. It covers manufacturing environment, equipment and materials, and offers examples of many ESD issues, such as with carts, floors and surfaces. Chapter Three goes more in depth to discuss ESD, EOS, EMI and Latchup. This middle section of the book also looks at pulse phenomena and failure mechanisms, Human Body Model (HBM), Machine Model (MM), Cassette Model, and Charged Device Model (CDM). It also covers Transmission Line Pulse (TLP), and Very Fast Transmission Line Pulse (VF-TLP). The next chapter goes to system level ESD to explain all of the above as well as Charged Device Model (CDM) and Cable Discharge Event (CDE). Chapter four informs what happens when systems and chips interact, looking specifically at hand held devices, disk drives, and servers and cables. It also discusses ESD in automobiles, airplanes and satellites. Chapter Five is called ESD Protection on Components?-?Problems and Solutions. It explains circuits, failure mechanisms, RF devices, micro-machines, power clamps and more. Chapter Six covers problems and solutions in ESD systems. It comprehensively covers the following: system level design solutions, system level failures, ESD and EMC, ESD guns, EMC scanning and cards and board solutions -?off-chip protection. The final chapter offers a full summary and conclusions.

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