Introduction to Microsystem Packaging Technology

微系统封装技术导论

光电子学与激光技术

原   价:
2188.75
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1751.00
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平台大促 低至8折优惠
发货周期:预计5-7周发货
出  版 社
出版时间
2010年09月29日
装      帧
精装
ISBN
9781439819104
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页      码
232
开      本
7x10
语      种
英文
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图书简介
Purposefully organized in independent chapters, the book systematically presents the widest possible overview of packaging knowledge. It illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. Other topics in include encapsulation and sealing and system-in-package, device-level and optoelectronics packaging, and modular assembly, inspection, and reliability design. The book provides a number of real-world case studies.
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