Bonding in Microsystem Technology

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原   价:
1657.5
售   价:
1326.00
优惠
平台大促 低至8折优惠
作      者
出  版 社
出版时间
2010年11月23日
装      帧
平装
ISBN
9789048171514
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页      码
331
语      种
英语
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库存 96 本
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图书简介

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. 978904817152101429

The focus of this book is the consideration of environmental issues in e

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