Force Sensors for Microelectronic Packaging Applications

光电子学与激光技术

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1105
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884.00
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平台大促 低至8折优惠
作      者
出  版 社
出版时间
2010年12月15日
装      帧
平装
ISBN
9783642060632
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页      码
178
语      种
英语
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图书简介

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bond

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