Tokunbo Ogunfunmi, Santa Clara University, Santa Clara, CA, USA; Roberto Togneri, The University of Western Australia, Crawley, WA, Australia; Madihally (Sim) Narasimha, Qualcomm Inc., Santa Clara, CA / 2016-10-01 / Springer Berlin Heidelberg
Bart Vermeulen, NXP Semiconductors, Eindhoven, The Netherlands; Kees Goossens, Eindhoven University of Technology, Eindhoven, The Netherlands / 2016-10-01 / Springer Berlin Heidelberg
Nabendu Chaki, University of Calcutta, Kolkata, India; Soharab Hossain Shaikh, University of Calcutta, Kolkata, India; Khalid Saeed, AGH University of Science and Technology, Kraków, Poland / 2016-09-27 / Springer Berlin Heidelberg
Manho Lee, KAIST, Daejeon, Korea, Republic of (South Korea); Jun So Pak, Samsung Electronics Co., Ltd, Hwaseong, Korea, Republic of (South Korea); Joungho Kim, KAIST, Daejeon, Korea, Republic of (Sout / 2016-09-27 / Springer Berlin Heidelberg
Jaeseok Kim, Yonsei University, Seoul, Korea, Republic of (South Korea); Hyunchul Shin, Hanyang University, Ansan, Korea, Republic of (South Korea) / 2016-09-27 / Springer Berlin Heidelberg
Gi-Chul Yang, Mokpo National University, Chonnam, Korea, Republic of (South Korea); Sio-Iong Ao, International Association of Engine, Hong Kong, Hong Kong SAR; Xu Huang, University of Canberra, Canber / 2016-09-27 / Springer Berlin Heidelberg
Christoph Guger, g.tec medical engineering GmbH/ Guger Technologies OG, Schiedlberg, Austria; Brendan Allison, UC San Diego, La Jolla, USA; E.C. Leuthardt, Washington University in St. Louis, St. Loui / 2016-09-27 / Springer Berlin Heidelberg
Zhi Ning Chen, National University of Singapore, Singapore, Singapore; Duixian Liu, IBM T.J. Watson Research Center, Yorktown Heights, NY, USA; Hisamatsu Nakano, Hosei University, Koganei , Japan; Xi / 2016-09-26 / Springer Singapore
Laura Caponetti, Università degli studi di Bari Aldo Moro, Bari, Italy; Giovanna Castellano, Universita degli Studi de Bari Dipartmento di Informatica, Bari, Italy / 2016-09-26 / Springer Berlin Heidelberg
Edward Layer, Cracow University of Technology, Cracow, Poland; Krzysztof Tomczyk, Cracow University of Technology, Cracow, Poland / 2016-09-24 / Springer Berlin Heidelberg
Lesaw Gobiowski, Rzesz體 University of Technology, Rzesz體, Poland; Damian Mazur, Rzesz體 University of Technology, Rzesz體, Poland / 2016-09-24 / Springer Berlin Heidelberg
Sanjoy Baruah, The University of North Carolina, Chapel Hill, NC, USA; Marko Bertogna, Università di Modena, Modena, Italy; Giorgio Buttazzo, Scuola Superiore SantAnna TeCIP Institute, Pisa, Italy / 2016-09-24 / Springer Berlin Heidelberg
Alex Mason, Liverpool John Moores University, Liverpool, UK; Subhas Chandra Mukhopadhyay, Massey University (Manawatu), Palmerston North, New Zealand; Krishanthi Padmarani Jayasundera, Massey Universi / 2016-09-24 / Springer Berlin Heidelberg
Danilo Demarchi, Politecnico di Torino, Torino, Italy; Alberto Tagliaferro, Politecnico di Torino, Torino, Italy / 2016-09-22 / Springer Berlin Heidelberg
Samuel A. Fricker, Blekinge Institute of Technology, Karlskrona, Sweden; Christoph Th黰mler, Edinburgh Napier University, Edinburgh, UK; Anastasius Gavras, Eurescom GmbH, Heidelberg, Germany / 2016-09-22 / Springer Berlin Heidelberg
Ilya V. Shadrivov, Australian National University, Canberra, ACT, Australia; Mikhail Lapine, University of Sydney, Sydney, NSW, Australia; Yuri S. Kivshar, Australian National University, Canberra, AC / 2016-09-22 / Springer Berlin Heidelberg
Pietro Burrascano, University of Perugia, Terni, Italy; Sergio Callegari, Universita di Bologna, Bologna, Italy; Augusto Montisci, University of Cagliari, Cagliari, Italy; Marco Ricci, University of P / 2016-09-22 / Springer Berlin Heidelberg
Alex Mason, Liverpool John Moores University, Liverpool, UK; Subhas Chandra Mukhopadhyay, Massey University (Manawatu), Palmerston North, New Zealand; Krishanthi Padmarani Jayasundera, Massey Universi / 2016-09-22 / Springer Berlin Heidelberg
János Tapolcai, Budapest University of Technology and Ec, Budapest, Hungary; Pin-Han Ho, University of Waterloo, Waterloo, Canada; Péter Babarczi, Budapest University of Technology and, Budapest, Hung / 2016-09-22 / Springer Berlin Heidelberg