Ka-Meng Lei, University of Macau, Macau, China; Pui-In Mak, University of Macau, Macau, China; Man-Kay Law, University of Macau, Macau, China; Rui Paulo Martins, University of Macau, Macau, China / 2018-08-25 / Springer Berlin Heidelberg
Franco Fummi, University of Verona, Verona, Italy; Robert Wille, Johannes Kepler University Linz, Linz, Austria / 2018-08-24 / Springer Berlin Heidelberg
Hani Saleh, Khalifa University of Science, Technology and Research, Abu Dhabi, United Arab Emirates; Nourhan Bayasi, Khalifa University of Science, Technology and Research, Abu Dhabi, United Arab Emir / 2018-08-24 / Springer Berlin Heidelberg
Franco Cicirelli, National Research Council (CNR), Rende (CS), Italy; Antonio Guerrieri, National Research Council (CNR), Rende (CS), Italy; Carlo Mastroianni, National Research Council (CNR), Rende ( / 2018-08-23 / Springer Berlin Heidelberg
Yuriy M. Penkin, National University of Pharmacy, Kharkiv, Ukraine; Victor A. Katrich, V.N. Karazin Kharkiv National University, Kharkiv, Ukraine; Mikhail V. Nesterenko, V.N. Karazin Kharkiv National / 2018-08-23 / Springer Berlin Heidelberg
Sanjiv K. Bhatia, University of Missouri, Columbia, MO, USA; Shailesh Tiwari, ABES Engineering College, Ghaziabad, India; Krishn K. Mishra, Motilal Nehru National Institute of Technology Allahabad, Al / 2018-08-23 / Springer Berlin Heidelberg
Ricardo Filipe Sereno P髒oa, Instituto de Telecomunica珲es, Instituto Superior T閏nico, Universidade de Lisboa, Lisboa, Portugal; Jo鉶 Carlos da Palma Goes, UNINOVA, Faculdade de Ci阯cias e Tecnologia / 2018-08-21 / Springer Berlin Heidelberg
Jan Eloff, University of Pretoria, Hatfield, South Africa; Madeleine Bihina Bella, University of Pretoria, Hatfield, South Africa / 2018-08-18 / Springer Berlin Heidelberg
Kamran Souri, SiTime Corp., Santa Clara, CA, USA; Kofi A.A. Makinwa, Delft University of Technology, Delft, The Netherlands / 2018-08-18 / Springer Berlin Heidelberg
Muhammad Usman Karim Khan, IBM Deutschland Research & Development GmbH, B鯾lingen, Germany; Muhammad Shafique, Vienna University of Technology, Vienna, Austria; J鰎g Henkel, Karlsruhe Institute of Tec / 2018-08-18 / Springer Berlin Heidelberg
Pieter Harpe, Eindhoven University of Technology, Eindhoven, The Netherlands; Kofi A. A. Makinwa, Delft University of Technology, Delft, The Netherlands; Andrea Baschirotto, University of Milan, Milan / 2018-08-18 / Springer Berlin Heidelberg
Yung-Chun Wu, National Tsing Hua University , Hsinchu, Taiwan, China; Yi-Ruei Jhan, Department of Engineering and System Sci National Tsing Hua University, Hsinchu / 2018-08-15 / Springer Berlin Heidelberg
Saurabh Nagar, Indian Institute of Technology Bombay, Mumbai, India; Subhananda Chakrabarti, Indian Institute of Technology Bombay, Mumbai / 2018-08-15 / Springer Berlin Heidelberg
Mohammed A. Gondal, King Fahd University of Petroleum & Mine, Dhahran, Saudi Arabia; Chang Xiaofeng, Nanjing Aeronautics and Astronautics Uni, Nanjing, China; Mohamed A. Dastageer, King Fahd Universit / 2018-08-15 / Springer Berlin Heidelberg
Heba Abunahla, Khalifa University of Science and Technology, Abu Dhabi, United Arab Emirates; Baker Mohammad, Khalifa University of Science and Technology, Abu Dhabi, United Arab Emirates / 2018-08-15 / Springer Berlin Heidelberg
H. S. Saini, Guru Nanak Institutions, Ibrahimpatnam, India; Rishi Sayal, Guru Nanak Institutions, Ibrahimpatnam, India; Sandeep Singh Rawat, Guru Nanak Institutions, Ibrahimpatnam, India / 2018-08-15 / Springer Berlin Heidelberg
Yuzo Iano, University of Campinas, Campinas, Brazil; Rangel Arthur, University of Campinas, Campinas, Brazil; Osamu Saotome, Instituto Tecnológico de Aeronáutica (ITA), São José dos Campos, Brazil; Va / 2018-08-15 / Springer Berlin Heidelberg
Yan Lu, University of Macau, Macao, China; Wing-Hung Ki, The Hong Kong University of Science and Technology, Hong Kong / 2018-08-12 / Springer Berlin Heidelberg
Jagannath Malik, Ulsan National Institute of Science and Technology, Ulsan, Korea (Republic of); Amalendu Patnaik, Indian Institute of Technology, Roorkee, India; M.V. Kartikeyan, Indian Institute of / 2018-08-11 / Springer Berlin Heidelberg