Gnanam Gnanagurunathan, The University of Nottingham Malaysia Campus, Semenyih, Malaysia; R.G. Sangeetha, VIT University, Chennai, India; K. Usha Kiran, VIT University, Chennai, India / 2019-02-11 / Springer Berlin Heidelberg
Jie Li, University of Melbourne, Melbourne, VIC, Australia; A Ravi Sankar, VIT, Chennai, India; P Augusta Sophy Beulet, VIT, Chennai, India / 2019-02-11 / Springer Berlin Heidelberg
Sourav Adhikary, National University of Singapore, , Singapore; Subhananda Chakrabarti, Indian Institute of Technology Bombay, Mumbai, India / 2019-02-11 / Springer Berlin Heidelberg
Pengfei Zhao, China Academy of Printing Technology, Beijing, China; Yun Ouyang, China Academy of Printing Technology, Beijing, China; Min Xu, China Academy of Printing Technology, Beijing, China; Li Y / 2019-02-11 / Springer Berlin Heidelberg
Asima Pradhan, Indian Institute of Technology Kanpur, Kanpur, India; Pradeep Kumar Krishnamurthy, Indian Institute of Technology Kanpur, Kanpur, India / 2019-02-09 / Springer Berlin Heidelberg
Robert LeMoyne, Northern Arizona University, Flagstaff, AZ, USA; Timothy Mastroianni, Independent, Pittsburgh, PA, USA / 2019-02-09 / Springer Berlin Heidelberg
Suresh Chandra Satapathy, PVP Siddhartha Institute of Technology, Vijayawada, India; Vikrant Bhateja, Shri Ramswaroop Memorial Group, Lucknow, India; P. Satish Rama Chowdary, Raghu Institute of Techno / 2019-02-09 / Springer Berlin Heidelberg
H. S. Saini, Guru Nanak Institutions, Ibrahimpatnam, India; R. K. Singh, Guru Nanak Institutions Technical Campus, Ibrahimpatnam, India; Girish Kumar, Indian Institute of Technology Bombay, Mumbai, In / 2019-02-08 / Springer Berlin Heidelberg
Pandian Vasant, Universiti Teknologi Petronas, Seri Iskanda, Malaysia; Igor Litvinchev, Universidad Autónoma de Nuevo León, San Nicolás de los Garza, Mexico; José Antonio Marmolejo-Saucedo, Universida / 2019-02-07 / Springer Berlin Heidelberg
Kofi A. A. Makinwa, Delft University of Technology, Delft, The Netherlands; Andrea Baschirotto, University of Milano-Bicocca, Milan, Italy; Pieter Harpe, Eindhoven University of Technology, Eindhoven, / 2019-02-07 / Springer Berlin Heidelberg
Beniamino Di Martino, Università degli studi della Campania Luigi Vanvitelli, Naples, Italy; Kuan-Ching Li, Providence University, Taichung, Taiwan; Laurence T. Yang, St. Francis Xavier University, An / 2019-02-01 / Springer Berlin Heidelberg
Suresh Chandra Satapathy, PVP Siddhartha Institute of Technology, Vijayawada, India; Vikrant Bhateja, Shri Ramswaroop Memorial Group of Professional Colleges, Lucknow, India; Swagatam Das, Indian Stat / 2019-02-01 / Springer Berlin Heidelberg
Martin I. Pech-Canul, Centro de Investigaci髇 y de Estudios Avanzados del Instituto Polit閏nico NacionalUnidad SaltilloIngenier韆 Cer醡ica, Ramos Arizpe, Mexico; Nuggehalli M. Ravindra, New Jersey I / 2019-01-29 / Springer Berlin Heidelberg
Sonajharia Minz, Jawaharlal Nehru University, New Delhi, India; Sushanta Karmakar, Indian Institute of Technology Guwahati, Guwahati; Latika Kharb, Jagan Institute of Management Studies, Delhi, India / 2019-01-26 / Springer Berlin Heidelberg
Mourad Fakhfakh, University of Sfax, Sfax, Tunisia; Marian Pierzchala, Wroclaw University of Technology, Wrocaw, Poland / 2019-01-24 / Springer Berlin Heidelberg
R. Maheswar, Sri Krishna College of Technology, Coimbatore, TN, India; G. R. Kanagachidambaresan, Institute of Science and Technology, Chennai, TN, India; R. Jayaparvathy, SSN College of Engineering, / 2019-01-24 / Springer Berlin Heidelberg
Deepak P, Queen’s University Belfast, Northern Ireland, UK; Anna Jurek-Loughrey, Queen’s University Belfast, Northern Ireland, UK / 2019-01-23 / Springer Berlin Heidelberg
Venkata Rajesh Pamula, imec, Leuven, Belgium; Chris Van Hoof, imec, Leuven, Belgium; Marian Verhelst, KU Leuven ESAT-MICAS, Leuven, Belgium / 2019-01-22 / Springer Berlin Heidelberg
Dong-Seong Kim, Kumoh National Institute of Technology, Gumi, Korea (Republic of); Hoa Tran-Dang, Kumoh National Institute of Technology, Gumi, Korea (Republic of) / 2019-01-22 / Springer Berlin Heidelberg